Copper Electroplating - LPCVD and PECVD Nitride - Thermal Oxide (Wet and Dry)  -  Metal Deposition  -  Copper Electroplating  -  Thin Films

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Copper and Gold Bump Processing Services
UniversityWafer will provide Copper and Gold Bump processing services including Bump Mask Design, Bump Lithography, Bump Pad Metal Deposition, Bump Electroplating, Photoresist and Excess Pad Metal Removal for 6" wafers only. Please contact us for more in details

Name
Organization
Email
Phone
Fax
Wafer
Diameter
Type  N       or        P
Orientation
Resistivity
Dopant
Thickness
Sides Polished  One-Side     Two-Side
Quantity
Other Requests